ByteCool- Direct to Chip Liquid Cooling

Product Decription

Accelerate Heat Removal at the Source with ByteCool D2C (Direct-to-Chip Cooling) 

ByteCool – Direct to Chip Liquid Cooling in the UAE is the apt solution to high-performance computing, artificial intelligence applications, machine learning, GPT, energy storage, etc. The latest generation of CPUs and GPUs has higher thermal densities, and more and more CPUs and GPUs are stacked into one rack. 

The direct-to-chip cooling is a next-gen cooling solution that circulates a special liquid coolant directly over the CPU, GPU, or ASIC chip inside a server. The liquid coolant has 3,000 – 4,000 times the heat capacity of air. It reduces the need for high-speed fans and massive air volumes. 

When the server power crosses 400 W for servers, liquid cooling is the only solution. The ByteCool Direct-to-Chip cooling system has 4 components: coolant distribution units, manifolds and connectors, a free cooling chiller, and a dry cooler. 

When you purchase the ByteCool D2C system, you’ll assemble the components based on your specific rack layout, cooling capacity needs, and site infrastructure. This modular approach ensures compatibility with diverse deployment scenarios, from small AI clusters to full-scale high-performance computing environments, without affecting the peak thermal performance and energy efficiency.

Coolant Distribution Units (CDU) (BT-050-CL, BT-350-CL, BT-010-CA, and BT-060-CL)  

  • Standard 19-inch rack-oriented design, making it easier to adjust with the existing layout and data center plan. 
  • Equipped with an intelligent control system to control, monitor, and access the key working status remotely and locally. 
  • Plug and play design, easy to connect to the IT server with self-healing quick connectors
  • Cooling type: Liquid-Liquid and Liquid-Air 
  • Capacity: 10.5 – 355.5 kW 
  • Supply temperature: 45 °C
  • Coolant: Water and glycol
  • Mount type: Rack mount, floor mount, and row mount; varies as per model

 

Manifolds and Connectors 

  • Manufactured using stainless steel for reliability and rugged durability.
  • Plug and play design, and can be combined with dry disconnects, self-healed quick connectors.
  • Provide an easy interface between cold plate loops in the servers and CDUs. 
  • Supports flexible input and output loop customization and is also vertical and horizontal adaptive. 

ChillFlow Free Cooling Chiller (CF-50 and CF-350)

  • Capacity DX Mode and FC Mode (for both CF 50 and 350): 50 – 350 and 52 – 390
  • It has a natural cooling design that operates in natural cooling mode at low temperatures. 
  • The highly efficient chiller unit’s internal threaded pipeline provides efficient heat exchange. 
  • Compatible with water, water and ethylene glycol mixture, and ensures reliable operation in different regions and environments temperatures
  • Use environment-friendly refrigerants, like R407C and R134A
  • It has an optional wet film evaporation cooling component to pre-cool the intake air, improving the PUE value. 
  • In-depth testing and repeated verification of the system design and device configuration

Dry Cooler (KSF50DC and KSF350DC)

    • Equipped with high high-performance heat exchanger system maximizing efficiency 
  • Capacity (for both KSF50DC and KSF350DC): 50kW and 350kW 
  • Coolant: Water, glycol, or a mixture of water and glycol for ambient temperature 
  • Fan type: VDC 
  • Working range: -35C to +35C 
  • An optional wet film design to pre-cool the air with evaporative cooling effects 
  • High corrosion and durable design, making it suitable for long-term applications.